Director's Corner

30 October 2008

Akira Yamamoto

Progress in the SCRF technical area

Today's issue features a Director's Corner from Akira Yamamoto, Project Manager for the Global Design Effort.

As one of Project Managers for the ILC I was been given the current task of overseeing superconducting radiofrequency technology (SCRF) in August 2007, and it may be a good time to see how our SCRF technical area could make some progress with global cooperation.

First of all, the field gradient in the superconducting cavity has been the most critical subject, and I should thank the various efforts for extended R&D based on much experience mainly from the FLASH R&D effort, rooted in the TESLA Technology Collaboration (TTC). Recently, the ILC Global Design Effort has received a very comprehensive technical assessment document from TTC. We recognise the hard and excellent work, and our sincere appreciation will be expressed by the Director Barry Barish in a future Director's Corner.

I am pleased to report that we have made good progress in discussions on the "plug-compatibility" for the R&D stage for the ILC and could get general support for this concept from the Project Advisory Committee (PAC) of the International Linear Collider Steering Committee (ILCSC), as well as by TTC.

Cross section of the S1-Global cryomodule assembly.

Recently, we have reached a good agreement to proceed the so-called "S1-Global" programme in which we will globally cooperate to assemble a set of cryomodules containing two cavities from Americas, two cavities from Europe, and four cavities from Asia. It will examine the plug-compatible assembly in global collaboration.

We are pleased with the above progress realised in the past one year through much global communication and through overcoming various difficulties. We the Project Managers have made our best effort to organise technical visits and face-to-face communication with various SCRF laboratories/institutes worldwide: DESY, CEA/Saclay, LAL/Orsay in Europe; Fermilab, SLAC, JLab, Cornell, LANL in Americas, and IUAC, RRCAT, TIFR, VECC, BARC, IHEP, KNU, PAL, and KEK in Asia, and it will be further extended to be completed.

We would thank all the worldwide collaborators, and look forward to our further global cooperation in the ILC Technical Design Phase.

-- Akira Yamamoto

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